SPS copper plating intermediate

• Product NameSPS copper plating intermediate
  CAS No.27206-35-5
  Purity90%
  Min Quantity100Kilograms
  Price~
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  Molecular Structure

Detailed Description

SPS
Chemical name Bis-(sodium sulfopropyl)-disulfide
Molecular formula C6H12O6S4Na2
Molecular weight 354.4
CAS No. 27206-35-5

Characteristic:
Appearance White or yellowish powder
Assay ≥90.0%(HPLC)
pH 3.0-7.0(38%water solution)
Solubility(20℃) 38% water solution in transparent and clear
Application SPS is used as a brightener and grain refiner in copper electroplating baths at a concentration of 10-50mg/L.
Packing 25kg
Storage condition Stored in cool and dry place
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• SPS copper plating intermediate