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4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl

  • CAS No.: 85954-11-6
  • Purity: 95%
  • Min quantity: 1 Metric Tons
  • Weight: 354.43944
  • Place of Orign: Lanzhou City,Gansu,China
Ms.Lisa Lee

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Item specifics

  • Product Name.:4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl
  • CAS No: 85954-11-6
  • Weight: 354.43944
  • Formula: C22H26O4
  • Melting Point: 105 ºC
  • Boiling Point: 473 ºC
  • Density: 1.149

Details

4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl
Synonym:3, 3’,5, 5’-Tetramethyl-4,4’-di(2,3-epoxypropanoxy)-bibenzene,TMDE
CAS NO : 85954-11-6
Molecular Formular:C22H26O4
Product Introduction:
TMDE is a two glycidyl ether type epoxy resin which has the structure of biphenyl. It has the good color and transparency.Compare to the common epoxy resin,it has the good heat-resistance and mechanical properties,high epoxy value186-197g/eq, total chlorine content lower than 1500ppm.TMDE is a new type of high performance-price ratio epoxy resin.
1、 With rigid backbone,has the high tg.
2、 Crystalline solid epoxy resin
3、 Low stress, high adhesive performance
4、 Methylcontent,has the low hygroscopicity.
5、 Low molten viscosity,0.1-0.2 p at 150℃,high highfluidity.

Technical indicators:
Item Unit Specification
Appearance(Gardner) G <15
? Epoxide Equivalent g/eq 186-197
Inorgannochlorine ppm <3
Conductivity
μs/cm <10
Ici Viscosity(150℃) P <0.2
Total Chlorine ppm <1500
Hydrolyzed Chlorine /25℃ ppm <100
Melting Point ℃ >100
Olatile Matter ppm <500
Usage:
Widely used as IC packing material,basicmatrial of powder coating,adhesives,printingink,especially popular for its ideal electrical insulation property in the field of electronic packing /mouding compound.
Package and Storage:
Packed at 25kgslaminated package bag,shelf life 12 months at the tempreature of 2-40℃.

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2,2',6,6'-tetramethyl-4,4'-biphenol

CAS No: 2417-04-1

Purity: 98% Min.

Min quantity: 1 null

Price: null ~ null null

Description: 2,2',6,6'-tetramethyl-4,4'-biphenol Synonym: 3,5,3',5'-Tetramethyl-biphenyl-4,4'-diol CAS NO.: 2417-04-1 Molecular Formular: C16H18O2 Structural Formula: Product Introduction: TMBP is a biphenyl type LCP intermediate.The epoxy resin which chemical sy...

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CAS No:85954-11-6 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,<br />6-dimethylphenoxy]methyl]oxirane

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