USI FUNCTIONAL SILANE USi-D1311 CAS NO.3069-29-2

Chemical Name
N-(β-aminoethyl)-γ-aminopropylmethyl- dimethoxysilane

Synonyms
N-[3-(Dimethoxymethylsilyl)propyl]ethylenediamine

CAS NO. : 3069-29-2
EINECS NO: 221-336-6


Introduction
Silane coupling agent for many thermoset and thermoplastic resins with glass or mineral fillers.SERVICE AT USICHEMICAL DOT COM

Specification
Appearance Colorless transparent liquid
Colour(Pt-Co) ≤ 25
Specific Gravity(20°C, g/cm3) 0.965-0.975
Refractive Index(nD25°C) 1.4440 -1.4490
Purity(% ) ≥ 97.0
Applications
Silane USi-D1311 may be used as an additive, meeting the need of special primers in numerous bonding applications.
USi-D1311 can display a good adhesion in the following systems:
RTV Silicones and Hybrid Silane-Crosslinked Sealants
Silane USi-D1311 can improve the adhesion of silicone-crosslinked sealants to a variety of substrates, including glass, aluminum and concrete. Silane USi-D1311 provides enhanced adhesion performance without negative influence on rate of elongation. The addition is 0.5 to 1.0 percent of fillers by weight.
Polysulfide Sealants
When added to single-double component polysulfide sealants, silane USi-D1311 provides better adhesion to a variety of substrates, including glass, aluminum and steel. The addition of USi-D1311 is typically 0.5 to 1.0 percent of the sealant by weight. It disperses well in the sealant and produces cohesive failure in the sealant rather than adhesive failure of the bond between the sealant and the substrate. Furthermore, the use of silane Si-69 can not use primers which enhance the adhesion strength between the coating.
Plastic Sealants
Silane USi-D1311, as a replacement of polyaminoamide adhesion promoter in plastic sealants, can improve bonding to metal substrates. In addition to increasing strength, the silane-modified plastic sealants . Silane USi-D1311 modified systems have a very light color and the cured compound is bubble-free.
Additive in Phenolic and Epoxy Molding Compounds
Silane USi-D1311, as an additive in phenolic and epoxy molding compounds, reduces the water absorption of molded composites. So it can improve wet electrical properties, particularly at low frequencies.

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